SnZnAl lead-free solder with high packaging reliabilityKITAJIMA, Masayuki; SHONO, Tadaaki; MASUDA, Satoshi et al.SPIE proceedings series. 2003, pp 762-767, isbn 0-8194-5189-4, 6 p.Conference Paper

Lead-free solder bump technologies for flip-chip electronic packaging applicationsKARIM, Zaheed S; CHOW, Alice; CHEUNG, Edwin et al.SPIE proceedings series. 2002, pp 570-575, isbn 0-8194-4500-2, 2VolConference Paper

Unleading the wayRICHARDS, Brian.Materials world. 2001, Vol 9, Num 1, pp 19-21, issn 0967-8638Article

Lead-free soldering : An overview and comparison of the viable solutionsSEELIG, Karl; SURASKI, David.SPIE proceedings series. 2000, pp 558-563, isbn 0-930815-62-9Conference Paper

Lead-free electronic soldersSUBRAMANIAN, K. N.Journal of materials science. Materials in electronics. 2007, Vol 18, Num 1-3, issn 0957-4522, 366 p.Serial Issue

A case study of lead free thick film conductors with lead free solder alloysBOKALO, Peter; SHAHBAZI, Samson; SLIMS, Theresa D et al.SPIE proceedings series. 2003, pp 71-76, isbn 0-8194-5189-4, 6 p.Conference Paper

Lead-Free Solders and Materials Issues in Microelectronic PackagingJournal of electronic materials. 2002, Vol 31, Num 11, pp 1129-1308, issn 0361-5235, 180 p.Conference Proceedings

Sn-Zn Lead-free solder applied to notebook personal computerSUZUKI, Motoji; MATSUOKA, Hiroshi; KONO, Eiichi et al.SPIE proceedings series. 2001, pp 298-303, isbn 0-8194-4317-4Conference Paper

The effect of lead-free solder paste on component placement accuracy and self-alignment during reflowLIUKKONEN, Timo; NUMMENPÄÄ, Pekka; TUOMINEN, Aulis et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 44-47, issn 0954-0911, 4 p.Article

Mechanism of fillet lifting in Sn-Bi alloysBOETTINGER, W. J; HANDWERKER, C. A; NEWBURY, B et al.Journal of electronic materials. 2002, Vol 31, Num 5, pp 545-550, issn 0361-5235Article

New lead-free thick film resistorsHORMADALY, J.SPIE proceedings series. 2002, pp 543-547, isbn 0-930815-66-1, 5 p.Conference Paper

Results of comparative reliability tests on lead-free solder alloysGROSSMANN, Gunter; NICOLETTI, Giovanni; SOLER, Ursin et al.Proceedings - Electronic Components Conference. 2002, pp 1232-1237, issn 0569-5503, isbn 0-7803-7430-4, 6 p.Conference Paper

Selection of Sn-Ag-Cu lead-free alloysSUGANUMA, K; KIM, K. S; HUH, S. H et al.SPIE proceedings series. 2001, pp 529-534, isbn 0-8194-4317-4Conference Paper

Thermal performance and microstructure of lead-free solder die attach interface in power device packagesHUFF, D; KATSIS, D; STINSON-BAGBY, K et al.SPIE proceedings series. 2003, pp 322-326, isbn 0-8194-5189-4, 5 p.Conference Paper

Developing and benchmarking lead-free processesRAE, Alan; LASKY, Ronald; BELMONTE, Joe et al.SPIE proceedings series. 2000, pp 605-610, isbn 0-930815-62-9Conference Paper

Epoxy flux for lead-free solderingWUSHENG YIN; LEE, Ning-Cheng.SPIE proceedings series. 2003, pp 731-738, isbn 0-8194-5189-4, 8 p.Conference Paper

Reliability of tin-lead balled BGAs soldered with lead-free solder pasteNURMI, Sami Tapani; RISTOLAINEN, Eero Olavi.Soldering & surface mount technology. 2002, Vol 14, Num 2, issn 0954-0911, 5, 7, 9, 35-39 [8 p.]Article

Lead-free soldering for CSP : The impact of higher temperature SMT assembly processingSOLBERG, Vern.SPIE proceedings series. 2000, pp 611-616, isbn 0-930815-62-9Conference Paper

On the factors affecting the dissolution of copper in molten lead-free solders and development of a method to assess the soldering parametersDI MAIO, D; HUNT, C. P.Soldering & surface mount technology. 2009, Vol 21, Num 4, pp 24-31, issn 0954-0911, 8 p.Article

Reliability and microstructure of lead-free solder die attach interface in silicon power devicesHUFF, D; KATSIS, D; STINSON-BAGBY, K et al.IEEE international reliability physics symposium. 2004, pp 567-568, isbn 0-7803-8315-X, 1Vol, 2 p.Conference Paper

Reliability of lead free BGA packagesPRASAD, Swaminath; CARSON, Flynn; KIM, G. S et al.SPIE proceedings series. 2000, pp 722-726, isbn 0-930815-62-9Conference Paper

Experiments and simulations of uniaxial ratchetting deformation of Sn-3Ag-0.5Cu and Sn-37Pb solder alloysKOBAYASHI, Takuji; SASAKI, Katsuhiko.Journal of materials science. Materials in electronics. 2009, Vol 20, Num 4, pp 343-353, issn 0957-4522, 11 p.Article

Rapid assessment of steady-state creep rates and stress dip effects in solder alloysGREASLEY, A.Journal of materials science. Materials in electronics. 2002, Vol 13, Num 1, pp 43-47, issn 0957-4522Article

Effects of latent damage of recrystallization on lead free solder jointsMAYYAS, Ahmad; QASAIMEH, Awni; BORGESEN, Peter et al.Microelectronics and reliability. 2014, Vol 54, Num 2, pp 447-456, issn 0026-2714, 10 p.Article

Effect of Pr on properties and Sn whisker growth of Sn-9Zn-xPr solderPENG XUE; SONGBAI XUE; YIFU SHEN et al.Soldering & surface mount technology. 2012, Vol 24, Num 4, pp 280-286, issn 0954-0911, 7 p.Article